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COG Packaging Market to Reach USD 5.89 Billion by 2034 as Display Driver and Advanced Packaging Demand Expands
Display manufacturers and semiconductor suppliers are developing compact electronic systems that require reliable connections between integrated circuits and display substrates. Chip-on-Glass (COG) packaging mounts integrated circuits directly onto glass substrates and is used in display-related applications, including LCD and OLED systems. According to SemiconductorInsight, the global COG...
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