Guru Guruprasad

Guru Guruprasad

@guruprasad

14 Publicações

0 fotos

0 Vídeos

Male

Atualizações Recentes

Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-06 07:51:53 ·

COG Packaging Market to Reach USD 5.89 Billion by 2034, Supported by Advanced Display and Semiconductor Applications

The continued development of high-resolution displays and compact electronic devices is increasing the importance of packaging technologies that support reliable connections between integrated circuits and display substrates. Chip-on-Glass (COG) packaging mounts integrated circuits directly onto glass substrates and is used primarily in display applications such as LCD and OLED panels....

0 Comentários ·0 Compartilhamentos ·94 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-06 07:20:44 ·

Backside Power Delivery Network for Intel RibbonFET Market to Reach USD 0.79 Billion by 2034

Advanced semiconductor processors require power-delivery architectures capable of supporting higher compute density, faster switching and improved electrical performance. Backside power delivery networks for Intel RibbonFET route supply voltage and ground signals beneath the active device structures, supporting the power-integrity requirements of gate-all-around transistor designs. According to...

0 Comentários ·0 Compartilhamentos ·154 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-06 06:48:53 ·

COF Packaging Market to Reach USD 5.89 Billion by 2034, Driven by Flexible Electronics and Advanced Displays

The demand for thinner electronic devices, high-resolution displays and compact semiconductor assemblies is increasing the importance of advanced packaging technologies. Chip-on-Film (COF) packaging integrates integrated circuits with thin-film substrates, enabling high-density interconnections while retaining the flexibility required in compact display and electronic products. According to...

0 Comentários ·0 Compartilhamentos ·11 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-06 06:21:38 ·

Battery Security ICs Market to Reach USD 1.18 Billion by 2030, Supported by Battery Authentication and Electrification

Rechargeable batteries are used across consumer electronics, electric vehicles, energy storage systems, industrial equipment and medical devices. Battery security integrated circuits support battery authentication and identification, helping host systems verify battery packs and distinguish authorized products from counterfeit or unrecognized units. According to SemiconductorInsight, the global...

0 Comentários ·0 Compartilhamentos ·19 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-06 05:53:21 ·

Cloud Managed Security Gateway Market to Reach USD 419 Million by 2034, Driven by Integrated Cloud Security Platforms

Enterprises are increasingly adopting cloud-based security management as they expand digital operations, support hybrid work environments and address increasingly sophisticated network threats. Cloud managed security gateways combine security functions with centralized cloud administration, helping organizations manage protection across distributed infrastructure. According to...

0 Comentários ·0 Compartilhamentos ·22 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-05 13:15:33 ·

Backside Power Delivery Network (BSPDN) Market to Reach USD 1.58 Billion by 2034

Semiconductor devices used in artificial intelligence, high-performance computing, automotive electronics and mobile systems require efficient power distribution within increasingly compact designs. Backside Power Delivery Network (BSPDN) architectures move power-delivery structures to the backside of a semiconductor package or substrate, aiming to improve power integrity and make more...

0 Comentários ·0 Compartilhamentos ·76 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-05 12:52:30 ·

Chiplet-Based Arm Neoverse Server CPU for Cloud-Native Market to Reach USD 3.42 Billion by 2034

Cloud-native computing, artificial intelligence and containerized workloads are increasing demand for server processors that combine scalable performance with efficient power consumption. Chiplet-based Arm Neoverse server CPUs use modular silicon dies for compute, I/O and memory functions, bringing multiple building blocks together through advanced interconnect technologies. According to...

0 Comentários ·0 Compartilhamentos ·69 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-05 12:30:38 ·

Cold Chain Environment Monitoring Sensors Market to Reach USD 9.24 Billion by 2034, Driven by Real-Time Supply-Chain Visibility

Temperature-sensitive products require controlled storage and transportation across pharmaceutical, food and other perishable-goods supply chains. Cold chain environment monitoring sensors provide continuous visibility into temperature, humidity, light exposure, door-open events, shock, tilt and location, helping operators identify excursions and maintain reliable records. According to...

0 Comentários ·0 Compartilhamentos ·54 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-05 12:30:34 ·

Cold Chain Environment Monitoring Sensors Market to Reach USD 9.24 Billion by 2034, Driven by Real-Time Supply-Chain Visibility

Temperature-sensitive products require controlled storage and transportation across pharmaceutical, food and other perishable-goods supply chains. Cold chain environment monitoring sensors provide continuous visibility into temperature, humidity, light exposure, door-open events, shock, tilt and location, helping operators identify excursions and maintain reliable records. According to...

0 Comentários ·0 Compartilhamentos ·52 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-05 11:44:56 ·

COG Packaging Market to Reach USD 5.89 Billion by 2034 as Display Driver and Advanced Packaging Demand Expands

Display manufacturers and semiconductor suppliers are developing compact electronic systems that require reliable connections between integrated circuits and display substrates. Chip-on-Glass (COG) packaging mounts integrated circuits directly onto glass substrates and is used in display-related applications, including LCD and OLED systems. According to SemiconductorInsight, the global COG...

0 Comentários ·0 Compartilhamentos ·17 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-05 11:15:37 ·

Backside Power Delivery Network for Intel RibbonFET Market to Reach USD 790 Million by 2034 as Advanced Processor Architectures Develop

Advanced semiconductor processors face increasing demands for power delivery, signal integrity and efficient use of routing resources. Backside power delivery networks address these requirements by moving key supply and ground connections to the underside of the silicon, helping reduce competition between power distribution and signal wiring on the front side of advanced devices. According to...

0 Comentários ·0 Compartilhamentos ·23 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!
Guru Guruprasad @guruprasad adicionou um novo artigo in Outro
2026-11-05 10:43:07 ·

COF Packaging Market to Reach USD 5.89 Billion by 2034 as Flexible Displays and Automotive Electronics Expand

Consumer electronics manufacturers are developing thinner devices, higher-resolution displays and compact electronic systems that require dense, reliable interconnections. Chip-on-Film (COF) packaging supports these requirements by integrating integrated circuits with thin-film substrates while retaining flexibility for compact product designs. According to SemiconductorInsight, the global COF...

0 Comentários ·0 Compartilhamentos ·17 Visualizações ·0 Anterior

Faça Login para curtir, compartilhar e comentar!

Mais Stories