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COF Packaging Market to Reach USD 5.89 Billion by 2034 as Flexible Displays and Automotive Electronics Expand
Consumer electronics manufacturers are developing thinner devices, higher-resolution displays and compact electronic systems that require dense, reliable interconnections. Chip-on-Film (COF) packaging supports these requirements by integrating integrated circuits with thin-film substrates while retaining flexibility for compact product designs. According to SemiconductorInsight, the global COF...
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