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COG Packaging Market to Reach USD 5.89 Billion by 2034, Supported by Advanced Display and Semiconductor Applications
The continued development of high-resolution displays and compact electronic devices is increasing the importance of packaging technologies that support reliable connections between integrated circuits and display substrates. Chip-on-Glass (COG) packaging mounts integrated circuits directly onto glass substrates and is used primarily in display applications such as LCD and OLED panels....
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