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COF Packaging Market to Reach USD 5.89 Billion by 2034, Driven by Flexible Electronics and Advanced Displays
The demand for thinner electronic devices, high-resolution displays and compact semiconductor assemblies is increasing the importance of advanced packaging technologies. Chip-on-Film (COF) packaging integrates integrated circuits with thin-film substrates, enabling high-density interconnections while retaining the flexibility required in compact display and electronic products. According to...
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